Hirose’s KM32A wire-to-board connector meets the GMW3191 standard for low-voltage automotive applications.

AOS Gen3 SiC MOSFETs provide up to a 30% improvement in switching FOM, while maintaining low conduction losses at high-load conditions.

The best approach now to securing LPWA IoT is developing products that are upgrade-ready and support crypto agility.

Skew represents a major design challenge for 224 Gbits/s PAM4 applications, causing delay differences within a differential ...

Aledia will showcase its FlexiNOVA customizable microLED platform for wearables, automotive, and consumer displays at Display ...

Wise-integration, in collaboration with Savoy, debuts a 7-kW SiC demo board for on-board chargers at PCIM 2025.

Silanna’s factory-configurable ADC Plural platform delivers improvements in affordability and lead times compared to legacy ...

AKM and SAL have developed a joint proof of concept for integrating a current sensor into a power module for automotive ...

NoMIS claims significant reductions in on-resistance for its 1.2-kV planar SiC MOSFETs, supporting higher-frequency switching ...

Navitas unveils first ‘AEC-Plus’ SIC MOSFETs in HV-T2PaK top-side cooled package, based on the company’s test results.

xMEMS Labs claims the first in-module active cooling for high-performance optical transceivers with its µCooling fan-on-a-chip technology. xMEMS Labs, Inc. has announced the expansion of its µCooling ...