u-blox Launches JODY-W6 Tri-Band Wi-Fi 6E and Bluetooth 5.4 Module for Industrial IoT Applications ...

AGNIT Semiconductors Raises $2.6 Million Seed Extension, Targets 1 Lakh GaN Components and Commercial Shipments from July 2027 ...

Bourns, introduced four new multilayer chip inductor series: CE0603G, CE0603M, CE1005Q, and CE1608Q. The inductors feature a monolithic structure created through advanced multilayer technology. They ...

Kyocera has announced it has completed the acquisition of all shares in NEC Toppan Circuit Solutions and the company has become a wholly-owned subsidiary. The new company name is KYOCERA Circuit ...

The new XJFlash from XJTAG allows you to automatically generate customized programming solution for the flash devices connected to FPGAs on your board. XJFlash automatically generate a custom design ...

Intel started volume production of finFET based 14nm semiconductor wafers. Intel's 14nm Core M processor architecture powered gadgets are going to hit the market during the Christmas and year-end ...

The new version of the Standard Co-Emulation Modeling Interface (SCE-MI) 2.3 from Accellera expands the set of SCE-MI compliant DPI function argument data types helping VLSI chip design engineers with ...

Cadence announced today that Entuple Technologies Pvt Ltd has been appointed as a Cadence Channel Partner in India as a value-added reseller (VAR) for the university segment. Cadence has selected ...

Swedish CAN hardware specialist Kvaser AB added two new products to its Leaf CAN to USB interface family, the Kvaser Leaf Pro HS v2 and Kvaser Leaf Pro HS v2 OBDII. Kvaser’s Leaf interface family is a ...

US based aerospace and defence focused company Data Device Corporation (DDC) acquired Emrise Electronics Ltd, which is comprised of UK located XCEL Power Systems Ltd and Pascall Electronics Ltd who ...

Analog integrated circuits form the backbone of countless electronic systems, serving as the essential interface between the physical world and digital processing systems. From precision sensors that ...

Semiconductor research organisation CEA-Leti presented a paper on how to Stack transistor sequentially in the same process flow for 3D-VLSI, at ongoing semiconductor manufacturing technology IEDM 2014 ...