Product Briefing Outline: ACI-ecotec GmbH & Co. KG has developed a new inline wafer separation system suitable for separating mono- and polycrystalline wafers in all common formats with thicknesses of ...

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

IMEC and Vrije Universiteit Brussel (VUB) built and demonstrated an on-wafer liquid phase chromatograph using sub-micron micromachining at last week's IEEE International Electron Devices Meeting. IMEC ...

The Chinese unit of Netherlands-based Nexperia has locked in supplies of silicon wafers from local firms to cover its entire ...

The move follows a corporate and geopolitical dispute that led the Netherlands to suspend wafer supplies to the Chinese unit, ...