The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

Enables earlier narrowing down of process and device options, reducing expensive and time-consuming wafer-based iterations Allows creation of higher-quality early Process Design Kits (PDKs) for design ...

In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different ...

With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, depending on complexity, a ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...

South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of ...

Ibis Technology Corp. today announced it has started shipping its Advantox MLD-UT wafers that offer an ultra-thin silicon layer as thin as 300-angstroms. According to the Danvers, Mass.-based company, ...

A silicon wafer is a thin slice of crystalline silicon typically grown using the Czochralski process, which involves pulling a crystal seed from a molten silicon bath. A silicon wafer is a thin slice ...