Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ...

As package sizes grow, warpage can become a real headache. A ceramic approach can offer rigidity where traditional materials ...

Built from Kyocera’s proprietary Fine Ceramic materials, the substrate is engineered for high‑density wiring and exceptional ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

Clorox has patented a method for creating multi-layer substrates using a thermoplastic material that allows for the passage of cleaning compositions between layers. The process involves bonding the ...