Dynamic micro-CT imaging reveals thermal deformation, solder ball displacement, and internal package behavior under elevated ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
New LV100-type standard package with integrated 3-level circuit contributes to standardized inverter designs Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has jointly developed ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.With bipartisan support, the ...
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