Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Wafer suppliers, having never reaped any significant benefits during 2000 despite a history-making upturn in the semiconductor cycle, are now having insult added to their injury during the current ...

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer ...

Q4 presented a new issue for O2Micro OIIM that occurred in the later part of the quarter. Due to production problems at its wafer supplier, O2Micro got its wafers late and supply will be affected from ...