Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to ...
Die-bonding at up to 60,000 flip-chips per hour, is what ITEC is claiming for its ADAT3 XF TwinRevolve. “Instead of the traditional forwards and backwards up-down linear motion, the new die bonder ...
CHAM, Switzerland — Chip-assembly equipment company ESEC has added a five-micron placement accuracy feature to its Micron 5003 die and flip chip attach machine. The accuracy is qualified with a newly ...
SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) will present the latest in loadport and chip flip technology at Booth 1905 in the North Hall at the SEMICON West Conference 2018, July 10 ...
Indium Corporation will feature its flip-chip flux WS-446HF and ball attach flux WS-823 at Semicon Taiwan 2018 from September 5-7. Indium Corporation's WS-446HF is a water-soluble, halogen-free ...
DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...
Mühlbauer, a company that manufactures turnkey solutions for the production of passive EPC Gen 2 ultrahigh-frequency (UHF) RFID inlays and their subsequent conversion into smart labels and smart ...
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