Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Epoxies to keep up with fast HP-RTM: This high-pressure RTM equipment in use at specialist vehicle manufacturer Penso Consulting Ltd. in the UK is molding parts with Cytec’s fast-cure epoxy, XMTM710.

COLUMBUS, Ohio--(BUSINESS WIRE)--FastRTM, a project of an industry consortium supported by IRT M2P, focused on enabling composite mass production, used a specialty epoxy resin system from Hexion Inc. ...

In 2013, KraussMaffei marketed the wetmolding process for the manufacture of fiber-reinforced plastic components, which it has subsequently continued to develop further. In the wetmolding process, a ...