EDN

Ultra-Thin Molded Chip Scale Package

Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...
Semiconductor Engineering

High Performance, Multi-Chip Leadframe Package With Internal Connections

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Electronic Design

Single Chip-Scale Package Houses Five Memory Chips

In a single chip-scale package (CSP) measuring only 1.4-mm in thickness, the company has managed to stack a PSRAM, one SRAM, and two flash memory chips, plus a spacer chip. Employing a proprietary ...
Electronic Design

Microchip Expands UNI/O EEPROM Line With Wafer-Level Chip-Scale And TO-92 Packages

Microchip has developed a single-I/O bus UNI/O EEPROM devices in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring 0.85 mm x 1.38 mm, the ...
Electronics Weekly

Wireless MCU for Bluetooth 5.3 LE in chip-scale package

ST has announced a wireless microcontroller with the Bluetooth 5.3 LE software, initially in a 5 x 5mm QFN, and scheduled to be available in a ~2.8 x 3mm chip-scale package. STM32WB09 (right) is built ...
EDN

Solid-state drive features tiny 12 x 18 x 1.8-mm chip-scale package

Using a standard parallel ATA interface and chip scale package-on-package technology, the Z-P140 PATA solid-state disk features a tiny 12 x 18 x 1.8 mm size, making it attractive for mobile products.
Digi Times

WLCSP specialist Xintec on track to expand capacity

Taiwan-based Xintec, a WLCSP (wafer level chip scale package) specialist under TSMC, has approved a capital expense of NT$2.5 billion (US$83.33 million) to expand capacity at existing production lines ...