Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
In a single chip-scale package (CSP) measuring only 1.4-mm in thickness, the company has managed to stack a PSRAM, one SRAM, and two flash memory chips, plus a spacer chip. Employing a proprietary ...
Maxim Integrated Products introduces the MAX16072-MAX16074 microprocessor supervisory circuits in a 1mm x 1mm chip-scale package Maxim Integrated Products introduces the MAX16072-MAX16074 ...
A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...
Leveraging Menlo’s Ideal Switch technology, the MM5230 RF switch minimizes insertion loss and provides high power handling in a chip-scale package. The device is a SP4T switch that operates from DC to ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
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