SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

~ 3F Energy appointed to serve customers across Europe; see us at Booth A095. SANTEE, Calif., August 20, 2025--(BUSINESS WIRE)--StratEdge Corporation, leader in the design and production of ...

May 9 (Reuters) - NGK SPARK PLUG CO LTD : * Says it had decided a basic policy about the structural reform of its ceramic IC package business at the Board of Directors Meeting held on May 9 * Says ...

AmpliTech Group, Inc's (NASDAQ: AMPG) Spectrum Semiconductor Materials division collaborated with NGK Electronic Devices, a company in the semiconductor packaging industry, to become their U.S.

The semiconductor ceramic packaging materials market size is projected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, registering a CAGR of 8.5% during the forecast period.

Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...

HyperBGA, a PTFE-based, coreless semiconductor package, allows silicon devices to run at speeds surpassing 12 Gb/s. The package, a combination of low-loss, low-dielectric-constant material and strip ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...

SAN DIEGO--(BUSINESS WIRE)--lt;a href="https://twitter.com/hashtag/APEC?src=hash" target="_blank"gt;#APEClt;/agt;--StratEdge ...