PITTSBURGH, USA: ANSYS has announced that its RedHawk and Totem products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET technology. TSMC has certified these ...
Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
ANSYS, Inc. …today announced the latest release of ANSYS Icepak software, which provides robust and powerful fluid dynamics technology for electronics thermal management. The 12.0 release introduces ...
Ansys Inc has announced a first milestone in coupling Ansys and Ansoft products, successfully performing multiphysics simulations that involve electromagnetic applications. The simulations target ...
PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
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